Wafer Machine – High-Speed and Uniform Cutting Solution for Potato, Banana, and Vegetable Wafers

The Wafer Machine is engineered for fast, precise, and hygienic slicing of potatoes, bananas, and other vegetables into uniform wafers for snack production.

Built with food-grade stainless steel and equipped with sharp, durable blades, it ensures consistent thickness and smooth cutting without damaging the texture of the raw material.

Ideal for snack manufacturers, commercial kitchens, and food processing units, the Wafer Machine increases production speed while maintaining product quality and reducing labor cost.

Product Specification

Motor Power: 0.5 Hp to 1 Hp

Cutting Capacity: 100 kg/hr to 300 kg/hr

Voltage: 220V – 240V (Single Phase)

Body Material: Stainless Steel (SS304 Food Grade)

Blade Material: Hardened Stainless Steel

Slice Thickness: Adjustable (1 mm to 5 mm)

Machine Weight: Approx. 60–100 kg

Operation Mode: Continuous Duty

Power Consumption: 0.4–0.75 kW/hr

Dimensions (L x W x H): 28 x 20 x 34 inches (approx.)